21. 9. 2016 The Japan Society for Abrasive Technology
Ninth floor of JR Sapia Tower
1-7-12 Marunouchi, Chiyoda-ku, Tokyo, 100-0005, JAPAN
Presentation: 15:00-15:50
25-26. 8. 2016 INNOVATION JAPAN 2016
Tokyo Big Sight, Tokyo, Japan
Exhibition: West Hall, Hall 1, NEDO area
8-12. 8. 2016 The 18th International Conference on Crystal Growth and Epitaxy (ICCGE-18)
Nagoya Congress Center

1-1 Atsuta-nishimachi, Atsuta-ku, Nagoya, 456-0036, JAPAN
Exhibition: Event Hall

29.6 - 1.7. 2016 AUTOMOTIVE ENGINEERING EXPOSITION 2016 NAGOYA
Nagoya International Exhibition Hall (Portmesse Nagoya)
Nagoya, Japan
Exhibition: Hall 2

2015 TOHO Engineering Co., Ltd. was awarded NEDO's Subsidies,
for Research and Development of optimal control technique of
semiconductor substrate polishing machine according to the pad surface measurement, and Development of ultra-flattening CARE technology
of the Silicon Carbide(SiC) and Gallium Nitride(GaN) substrates.
2014 Sales of CMP Pad Inspection Device (INS Series).
11-12.12. 2014 NAGOYA2014 AUTOMOTIVE ENGINEERING EXPOSITION
Nagoya International Exhibition Hall (Portmesse Nagoya)
Nagoya, Japan
Booth: TAKUMI

3-5.12. 2014 SEMICON Japan 2014
Tokyo, Japan
19-21.11. 2014 ICPT 2014
International Conference on Planarization/CMP Technology
Kobe, Japan
14-15.11. 2014 Industry Exhibition in Mie Prefecture (Japan 2014)
4-5.9. 2014 The International Industrial Fair 2014 Kobe
14.3.2014 "MONOZUKURI” Innovation Seminar
 Presentation: 14:00-16:30
7-8.11. 2013 Industry Exhibition in Mie Prefecture (Japan 2013)
30.10 - 1.11. 2013 ICPT 2013
International Conference on Planarization/CMP Technology
Ambassador Hotel, Hsinchu, Taiwan
31.7.2013 TOHO Engineering Co., Ltd. was awarded
the METI's Subsidies for Projects to Promote
the Enhancement of Manufacturing Technology for SMEs,
one of SBIR Funding, for Development of the CARE processing technology aimed at practical application of the GaN and SiC substrates for automobile use.
22.4. 2013 The Planarization and CMP Technical Committee
 Presentation: 15:30-16:05
13-15.3. 2013 The Japan Society for Precision Engineering  
2013 JSPE Spring Meeting
Presentation: Wednesday, March 13, 14:40-15:00, Room J, J18
19-20.2. 2013 Core Manufacturing Technology (Japan 2013)
13-14.2. 2013  Industry Exhibition in Mie Prefecture (Japan 2013)
5-7.12. 2012 SEMICON Japan 2012
15-17.10. 2012 ICPT 2012
International Conference on Planarization/CMP Technology
France
27.4. 2012 TOHO Engineering Co., Ltd. was awarded the METI's Subsidies
for Projects to Promote the Subsidy for Advanced Technology
Demonstration and Evaluation Facility Development,
one of SBIR Funding, for Development of
evaluation equipment and prototype manufacturing
of large-diameter SiC substrate polishing pad by "CARE".
2011 Sales of the Auxiliary Plate (SAISEI ECO CAP®).
17.12. 2010 TOHO Engineering Co., Ltd. was awarded
the METI's Subsidies for Projects to Promote
the Enhancement of Manufacturing Technology for SMEs,
one of SBIR Funding, for Development of planarization
of TSV semiconductor substrates.
2000 Sales of Pad Processing Machine (CMP Series).