toho engineering Co.,Ltd. TEL (+81)-59-364-3811
FAX (+81)-59-364-3912
443 Aza kawanoshita, Yamake-cho, Yokkaichi-city, Mie, 512-8041 JAPAN




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Company Name  TOHO Engineering Co., Ltd.
Representative  Tatsutoshi Suzuki, President
Head Office  443 Aza Kawanoshita, Yamake-cho, Yokkaichi-city,
 Mie, 512-8041 JAPAN
 Tel: +81-59-364-3811, Fax: +81-59-364-3912
 E-mail: suzuki@tohokoki.jp
Founded  February 5, 1986
Capital  Paid-in capital 50 million yen
Main Business  CARE (CAtalyst-Referred Etching) processing,
 CMP processing, Pad processing
 Research, manufacture, and sale of Auxiliary plate,
 Pad processing equipment, Pad Inspection Device etc.

1998  Business launch of the groove processing on CMP pads.
2000  Sales of Pad Processing Machine (CMP Series).
2002  Member of The Planarization and CMP Technical Committee. Installation of Clean rooms.
 Shipment of CMP Pads for semiconductor industries of U.S. .
2003  Cooperative research on the effects of Variable Pad Grooving Geometries on CMP
 with Professor Doi of Saitama University.
2004  Invested in Araca Incorporated and newly launched the comprehensive service of CMP.
2005  Established a business alliance with SEJEONG Engineering Co., and started business in Korea.
2008  Cooperative research on the TSV-CMP with Professor Chen
 of National Taiwan University of Science & Technology.
2009  Cooperated in Pad processing used for the research of CAtalyst-Referred Etching (CARE) developed
 by Professor Yamauchi and Associate professor Sano of Osaka University.
2010  TOHO Engineering Co., Ltd. was awarded the METI's Subsidies
 for Projects to Promote the Enhancement of Manufacturing Technology for SMEs,
 one of SBIR Funding, for Development of planarization of TSV semiconductor substrates.
2011  Sales of Auxiliary Plates. [SAISEI ECO CAP ®]
2012  TOHO Engineering Co., Ltd. was awarded the METI's Subsidies for Projects
 to Promote the Subsidy for Advanced Technology Demonstration and Evaluation Facility Development,
 one of SBIR Funding, for Development of evaluation equipment and prototype manufacturing
 of large-diameter SiC substrate polishing pads by CARE.

 Collaborative research with CEA-Leti (Le Laboratoire d’électronique des technologies
 de l’information du Commissariat ál’énergie atomique et aux energies alternatives) for reprocessed pads.
2013  TOHO Engineering Co., Ltd. was awarded the METI's Subsidies
 for Projects to Promote the Enhancement of Manufacturing Technology for SMEs,
 one of SBIR Funding, for Development of the CARE processing technology aimed
 at practical application of the GaN and SiC substrates for automobile use.
2014  Sales of CMP Pad Inspection Device (INS Series).
2015  One of Japan's National Research and Development Agencies,
 NEDO promotes R&D into energy, environmental, and industrial technologies.
 It is the largest public R&D funding organization in Japan.

 TOHO Engineering Co., Ltd. was awarded NEDO's Subsidies,
 for Research and Development of optimal control technique of
 semiconductor substrate polishing machine according to the pad surface measurement
  (Collaborative research with Associate Professor Norikazu Suzuki of Nagoya University),
 and Development of ultra-flattening CARE technology
 of the Silicon Carbide(SiC) and Gallium Nitride(GaN) substrates.
 About NEDO


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